| 发明名称 |
LEAD FRAME FOR AN INTEGRATED CIRCUIT CHIP (SMALL WINDOW) |
| 摘要 |
A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner. |
| 申请公布号 |
SG91808(A1) |
申请公布日期 |
2002.10.15 |
| 申请号 |
SG19990000055 |
申请日期 |
1999.02.09 |
| 申请人 |
INSTITUTE OF MICROELECTRONICS |
发明人 |
CHAI TAI CHONG;LIM THIAM BENG;TEO YONG CHUA;JAMES TAN;RAYMUNDO CAMENFORTE;ERIC NEO;DANIEL YAP |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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