| 摘要 |
A chip peeling apparatus has a plurality of protrusions which include first protrusions and second protrusions lower than the first protrusions. A vacuum pump communicates through holes with grooves defined between adjacent ones of the protrusions. A UV sheet is attached to chips, and the chips are supported in the vicinity of their corners by the tops of the first protrusions. When the vacuum pump is actuated, the chips and streets disposed between the chips are lowered, and the chips are curved and supported in abutment against the tops of the second protrusions. Each of the chips is gradually peeled off the UV sheet under a force tending to recover the original shape of the curved sheet. The chip peeling apparatus is effective in preventing the chips from being damaged and positionally deviated when the chips are attracted and carried.
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