发明名称 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
摘要 |
Methods and apparatuses for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressing a substrate assembly against a planarizing surface of a polishing pad at a pad/substrate interface defined by a surface area of the substrate assembly contacting the planarizing surface. The method continues by moving the substrate assembly and/or the polishing pad with respect to the other to rub at least one of the substrate assembly and the planarizing surface against the other at a relative velocity. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals. The measured drag force can be used to generate a plot of work versus time. The work versus time plot is then integrated to determine an estimated work exerted at the pad/substrate interface. The planarizing process is terminated when the estimated thickness is at least approximately within a range of desired substrate assembly thickness for endpointing the substrate assembly according to a predetermined relationship between work and substrate assembly thickness.
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申请公布号 |
US6464824(B1) |
申请公布日期 |
2002.10.15 |
申请号 |
US19990386648 |
申请日期 |
1999.08.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
HOFMANN JAMES J.;SABDE GUNDU M.;KRAMER STEPHEN J.;JOSLYN MICHAEL JAMES |
分类号 |
B24B37/04;B24B49/16;H01L21/306;(IPC1-7):H01L21/463 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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