发明名称 |
Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same |
摘要 |
A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.
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申请公布号 |
US6465085(B1) |
申请公布日期 |
2002.10.15 |
申请号 |
US20000699569 |
申请日期 |
2000.10.31 |
申请人 |
FUJITSU LIMITED |
发明人 |
SONG ZHIYI;MORIIZUMI KIYOKAZU;SASAHARA TAKAMI;OZAKI NORIKAZU;WATANABE MANABU;UMEMATSU MISAO;KIKUCHI SHUNICHI |
分类号 |
H01L23/538;H05K1/03;H05K3/22;H05K3/24;H05K3/38;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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