| 摘要 |
An electronic device/heat sink assembly having at least first and second heat generating electronic devices, a heat sink member, a resilient integral spring clip, the clip including a base member and first and second oppositely facing resilient leg members extending from opposite ends of the base member, the heat sink member having oppositely facing first and second surfaces, a separate one of the electronic devices positioned on each of the first and second sink surfaces, the clip dimensioned and positioned such that the leg members sandwich the devices and heat sink therebetween.
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