发明名称 Laser joining method and a device for joining different workpieces made of plastic or joining plastic to other materials
摘要 A method and a device for laser joining of plastics or for joining plastics to other materials, which are brought into contact with pressure, with the workpiece closest to the laser beam source being largely transparent for the laser beam, and the second workpiece being as absorbent as possible. By producing a laser beam shaped in the form of a line on the contact surface between the workpieces and by a relative movement of the laser beam relative to the workpieces, designed according to the desired joint seam structure, the workpieces are bonded together accurately only in the desired joining areas. This permits a highly accurate bonding with the smallest possible joint seam distances, so that even parts for micro-systems engineering can also be produced with a short cycle time.
申请公布号 US6465757(B1) 申请公布日期 2002.10.15
申请号 US20000488819 申请日期 2000.01.20
申请人 LEISTER PROCESS TECHNOLOGIES 发明人 CHEN JIE-WEI
分类号 B23K26/06;B29C65/16;B29C65/78;(IPC1-7):B23K26/00;B23K26/14 主分类号 B23K26/06
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