POLISHING TEMPERATURE MEASUREMENT METHOD, POLISHING METHOD, WORKPIECE HOLDING MECHANISM AND POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To correctly measure a polishing temperature while polishing a workpiece. SOLUTION: This workpiece holding mechanism 10 for holding the workpiece 3 in a plane vertical to a pressing direction is provided with a cylindrical shaft part 12, a plate member 14 having an infrared-ray transmitting part 16, and a lip seal 18 positioned on the back face of a peripheral part of the workpiece. The workpiece 3 is pressed against a polishing pad 28 by the pressure of a fluid fed to a space part 31 formed by the plate member, the lip seal and the workpiece. The workpiece is polished by relatively moving the workpiece with respect to the polishing pad with the workpiece pressed against the polishing pad. At least two infrared rays having different wavelengths or wavelength regions are extracted by using optical filters 38a and 38b, and the radiant quantity of the infrared ray of each wavelength or wavelength region is measured by using an infrared radiation ray thermometer 30 disposed above the shaft part, and the measured radiant quantity is arithmetically processed by an arithmetic processing device 40, so that the temperature of the polished surface of the workpiece is found.