SOLDER FOIL, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide fresh solder and a method for manufacturing the solder, or electronic apparatus using this solder and a method for manufacturing the apparatus, and also to provide solder connection in temperature hierarchical connection necessary in the method manufacturing the electronic apparatus, more particularly the solder connection on a high-temperature side. SOLUTION: This solder foil is formed by rolling a solder material containing Cu particles 2 as metallic particles and Sn particles 3 as solder particles. The Cu is in the state of the particles and the Sn is in a state 4 of embedding the spacings among the Cu particles. The surfaces of the Cu particles are covered by Cu6Sn5 when the particles are caused to reflow. The electronic apparatus connected by using this foil is provided.