| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module of low thermal resistance wherein a remaining void is eliminated in a solder adhesion layer between an insulation substrate on which a semiconductor element is mounted and a supporting substrate. SOLUTION: Relating to the module, an insulation substrate 10 is assigned on a supporting substrate, and a semiconductor chip is mounted on the insulation substrate. In that case, the structure of insulation substrate 10 is so configured that, at solder-bonding, a stress to deform a bonding side to a supporting substrate into a convex shape acts. For example, a film thickness t1 of an upper part metalize pattern 11 on the semiconductor element mounting side of the insulation substrate 10 is made thinner than a film t2 of a lower part metalize pattern 12 on a supporting substrate side. Thereby, at solder-bonding, the supporting substrate bonding side of insulation substrate 10 is deformed into a convex shape, for the void generated in a molten solder to be released to a periphery part. Thus, void in a solder layer is reduced, to provide a module having low thermal resistance with a long life. |
