发明名称 |
PACKAGING METHOD FOR PLASMA DISPLAY PANEL MODULE |
摘要 |
PROBLEM TO BE SOLVED: To prevent a panel module from being damaged during the transport of a plasma display device. SOLUTION: A peripheral portion of a panel module 40 is protected by covering the peripheral portion of the panel module 40 with a front surface protective cover 41 made of a resin, having the shape of substantially the same size as that of a front surface frame of a finished product of a plasma display device. Thus, the panel module 40 is prevented from being damaged during transport.
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申请公布号 |
JP2002302193(A) |
申请公布日期 |
2002.10.15 |
申请号 |
JP20010106736 |
申请日期 |
2001.04.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
WATABE HIROSHI;TOGO HIDENORI;SASAKI SHOZO |
分类号 |
B65D85/68;B65D5/50;B65D77/02;B65D77/26;B65D81/02;B65D81/107;B65D81/113;B65D85/38;B65D85/48;B65D85/86;G09F9/00;H01J17/49;H05K7/00;(IPC1-7):B65D85/86 |
主分类号 |
B65D85/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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