发明名称 PACKAGING METHOD FOR PLASMA DISPLAY PANEL MODULE
摘要 PROBLEM TO BE SOLVED: To prevent a panel module from being damaged during the transport of a plasma display device. SOLUTION: A peripheral portion of a panel module 40 is protected by covering the peripheral portion of the panel module 40 with a front surface protective cover 41 made of a resin, having the shape of substantially the same size as that of a front surface frame of a finished product of a plasma display device. Thus, the panel module 40 is prevented from being damaged during transport.
申请公布号 JP2002302193(A) 申请公布日期 2002.10.15
申请号 JP20010106736 申请日期 2001.04.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 WATABE HIROSHI;TOGO HIDENORI;SASAKI SHOZO
分类号 B65D85/68;B65D5/50;B65D77/02;B65D77/26;B65D81/02;B65D81/107;B65D81/113;B65D85/38;B65D85/48;B65D85/86;G09F9/00;H01J17/49;H05K7/00;(IPC1-7):B65D85/86 主分类号 B65D85/68
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