| 摘要 |
A semiconductor device is disposed on a circuit board such that respective bumps are brought in direct contact with respective circuit electrodes, and diffusion bonding is caused to occur at respective bonding faces between the respective bumps and the respective circuit electrodes by applying ultrasonic vibration and a load from the side of the semiconductor device by an ultrasonic and load application tool, and by applying heat from the side of the circuit board, and thereafter, a gap between the semiconductor device and the circuit board is filled up with an insulating sealing resin, which is then cured.
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