发明名称 |
Electronic package structure utilizing aluminum nitride/aluminum composite material |
摘要 |
A packaged electronic structure includes an electronic device, and a package to which the electronic device is affixed. At least a portion of the package is made of a composite material of aluminum nitride dispersed in aluminum. The composite material is preferably prepared by mixing powders of the aluminum nitride and aluminum, and thereafter pressing and sintering the mixture.
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申请公布号 |
US6465733(B1) |
申请公布日期 |
2002.10.15 |
申请号 |
US19970902465 |
申请日期 |
1997.07.29 |
申请人 |
HUGHES ELECTRONICS CORP. |
发明人 |
ALI M. AKBAR;PETERSON CARL W.;TAGHAVI HUTAN;BULLER BRUCE W. |
分类号 |
C22C29/16;H01L21/48;H05K1/03;(IPC1-7):H01L23/02 |
主分类号 |
C22C29/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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