发明名称 |
Graded metallic leads for connection to microelectronic elements |
摘要 |
Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between the first and second layers is achieved by controlling the grain size during deposition of the respective layers from an electroless or electroplating bath.
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申请公布号 |
US6465744(B2) |
申请公布日期 |
2002.10.15 |
申请号 |
US19990277521 |
申请日期 |
1999.03.26 |
申请人 |
TESSERA, INC. |
发明人 |
BAKER DAVID R.;WANG HUNG-MING |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H05K1/16 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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