发明名称 |
Power semiconductor device and method of manufacturing the same |
摘要 |
A power semiconductor device has a plurality of U-shaped buried layers buried in a drift layer and made of either an insulating material or a semiconductor having a wider bandgap than that of the semiconductor of the drift layer. The ratio of the product of the height H of the U-shaped buried layers and the arrangement pitch d to the spacing g between adjacent ones of the U-shaped buried layers is expressed as Hd/g<=13.2. With this configuration, a power semiconductor device having both a high breakdown voltage and a low on resistance can be realized.
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申请公布号 |
US6465844(B2) |
申请公布日期 |
2002.10.15 |
申请号 |
US20010904888 |
申请日期 |
2001.07.16 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SAITO WATARU;OMURA ICHIRO |
分类号 |
H01L21/265;H01L21/336;H01L21/74;H01L27/04;H01L29/06;H01L29/08;H01L29/10;H01L29/32;H01L29/40;H01L29/772;H01L29/78;H01L29/872;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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