| 摘要 |
There is provided a microstrip line-waveguide conversion structure, an integrated circuit package for high frequency signals provided with this conversion structure, and a manufacturing method therefor, which are capable of reducing the passage loss even when frequencies in the millimeter band are employed, which has a simple structure, and which is capable of application to broadband frequencies. This package is provided with a base member 4 on which an MMIC 2 and the like are installed, a dielectric substrate 5 which is provided on this base member 4, a microstrip line 6 which is provided on the dielectric substrate 5 and which is electrically connected to the integrated circuit for high frequency signals, a frame member 7, in which an opening 7a which encloses the integrated circuit for high frequency signals is formed, and in which a concave portion 7b which engages with the dielectric substrate 5 is formed, and a cover member 8 which seals the opening 7a of frame member 7 and creates an airtight seal. The waveguide portion 5a which is formed by the engaging of concave portion 7b with the widened portions 6d on the dielectric substrate 5 serves as a waveguide employing a dielectric material as the medium thereof, and converts the transmission mode of the high frequency signals transmitted by the microstrip line 6 to the transmission mode of the dielectric waveguide.
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