Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages

摘要

Integrated circuit packages having offset segmentation, or splitting, of package power and/or ground layers and methods for preventing delamination in package substrates having segmented power and/or ground layers are described. The package substrate includes a plurality of split power and/or ground plane layers that are isolated by split lines. The split lines from at least two of the split power and/or ground plane layers are offset relative to one another. In some embodiments, in addition to being offset, the split lines may be arranged to minimize their respective cross-over points, as well as convoluted to increase their effective length.