| 摘要 |
PURPOSE: A laminating method of a TBGA(Tape Ball Grid Array) semiconductor package is provided to improve the adhesive strength between a tap tape and each layer of a semiconductor frame by compressing the semiconductor frame with the tap tape. CONSTITUTION: A frame(150) for TBGA semiconductor package is formed with one or more metal plates. A tap tape on which a circuit pattern layer is formed is adhered on the frame(150) for TBGA semiconductor package. The frame(150) for TBGA semiconductor package is moved on a rail, continuously. A rolling speed and intervals(t1,t2,t3) of the first to the third up-and-down roller(110,120,130) can be controller by kinds and types of material in the frame(150) for TBGA semiconductor package. The intervals(t1,t2,t3) of the first to the third up-and-down roller(110,120,130) is reduced according to a transferring direction of the frame(150) for TBGA semiconductor package. A pressure of the second up-and-down roller(120) is higher than the pressure of the first up-and-down roller(110). The pressure of the third up-and-down roller(130) is higher than the pressure of the second up-and-down roller(120).
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