| 摘要 |
PURPOSE: To constitute an IC chip having different arrangement of power supply terminals using a semiconductor chip in the same design. CONSTITUTION: In a semiconductor chip 5, a second power supply pad 52 applied with a ground potential GND is arranged contiguously to a first power supply pad 51 applied with a power supply potential VDD. Signal pads 53 of such a number as corresponding to the size of an external component, e.g. a bypass capacitor, being inserted between the power supply terminals of an IC chip 4 are arranged contiguously to the second power supply pad, and a third power supply pad 54 applied with a ground potential GND is arranged contiguously to the signal pad 53. The second power supply pad 52 or the third power supply pad 54 is selected depending on the size of the external component and connected with a lead terminal of the IC chip 4 applied with the ground potential GND, thus providing a power supply terminal applied with the ground potential GND. |
