发明名称 SOLID-STATE RELAY
摘要 <p>PROBLEM TO BE SOLVED: To provide a small solid-state relay which can pass a high current. SOLUTION: The solid-state relay comprises a light emitting element 1 and a light receiving element 2, a drive element 3 connected with the light receiving element 2, a primary mold resin 5 covering the light emitting element 1, the light receiving element 2, and the drive element 3, and a secondary mold resin 6 covering the outer circumference of the primary mold resin 5 and provided, on a part of the surface, with one or a plurality of protrusions and recesses 7.</p>
申请公布号 JP2002299483(A) 申请公布日期 2002.10.11
申请号 JP20010104009 申请日期 2001.04.03
申请人 SHARP CORP 发明人 UEKAWA KAZUYA
分类号 H01L23/29;H01L23/02;H01L23/31;H01L31/12;H03K17/78;(IPC1-7):H01L23/02 主分类号 H01L23/29
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