| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste for forming a wiring part in which glass content does not come out floating on the surface of a conductive layer part that is formed by using the conductive paste on a glass ceramic substrate, and a wiring board using the same, and its manufacturing method. SOLUTION: The conductive paste is made by mixing 0.5-30 mass % of a first silver material powder having an average particle size of 0.3-2μm and 70-99.5 mass % of a second silver material powder having an average particle size of 3-5μm. It further contains 0.2-1 parts by mass of manganese dioxide, 0.2-1 parts by mass of copper oxide, 0.3-1 parts by mass of silicon dioxide, and 3-5.6 parts by mass of molybdenum and tungsten against the total 100 parts by mass of the first silver material powder and second silver material powder. This wiring board comprises a substrate made mainly of borosilicate lead system glass, a conductive layer part formed using the above conductive paste, and a plated layer part formed on the conductive layer part, and the maximum diameter of the recessed part on the conductive layer part is 6μm.
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