发明名称 EPOXY RESIN COMPOSITION FOR MOLDING, EXCELLENT IN FIRE RETARDANCY
摘要 PURPOSE: Provided is an epoxy resin composition for molding, which dose not pollute environment when disused and incinerated and is excellent in hardness, endothermic capacity, heat loss rate, insulation breakdown voltage, and fire retardancy. CONSTITUTION: The epoxy resin composition comprises 20-25wt% of an epoxy resin, 4-10wt% of a low viscosity epoxy resin as a reactive diluent, 0.1-0.5wt% of an additive comprising an epoxy vinyl resin as a coupling agent and a silicon resin as a foaming agent, 40-50wt% of aluminum hydroxide and/or calcium carbonate as a filler, and 14.5-35.9wt% of a fire retardant component comprising a mixture of melamine polyphosphate and ammonium polyphosphate, melamine polyphosphate, and barium nitrate.
申请公布号 KR20020076517(A) 申请公布日期 2002.10.11
申请号 KR20010016414 申请日期 2001.03.29
申请人 SAMSUNG SPECIAL CHEMICAL CO., LTD. 发明人 LEE, SEUNG JIN;PARK, JONG MUN;PARK, YUN YONG
分类号 C08L63/00 主分类号 C08L63/00
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