发明名称 |
POROUS PARA-ORIENTED AROMATIC POLYAMIDE FILM, ITS PREPREG AND SUBSTRATE USING PREPREG AND USED FOR PRINTED CIRCUIT |
摘要 |
PURPOSE: To provide a porous para-aromatic polyamide film with a light weight and a low thermal linear expansion coefficient which are the characteristics of a para-aramid, and having large tear-spreading resistance, to provide a method for producing the film, to provide a prepreg prepared by impregnating the film with a thermoplastic resin and/or a thermosetting resin, and to provide a substrate using the prepreg and used for a printed circuit. CONSTITUTION: This porous para-aromatic polyamide film comprises 100 pts.wt. of a para-aromatic polyamide and 10 to 400 pts.wt. of fine particles comprising a heat-resistant resin, and has a thermal linear expansion coefficient of <=±50x10¬-6/°C at 200 to 300°C. The method for producing the film. The prepreg produced by impregnated the film with a thermoplastic resin and/or a thermosetting resin. The substrate using the prepreg and used for a printed circuit. |
申请公布号 |
KR20020077155(A) |
申请公布日期 |
2002.10.11 |
申请号 |
KR20020016773 |
申请日期 |
2002.03.27 |
申请人 |
SUMITOMO CHEMICAL CO., LTD. |
发明人 |
SHINOHARA YASUO;TAKAHASHI TSUTOMU |
分类号 |
C08J5/24;C08J5/18;C08J9/00;C08J9/26;C08L67/03;C08L77/08;C08L77/10;C08L79/06;C08L79/08;H05K1/03 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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