| 摘要 |
PURPOSE: A chip on film package having a test pad for evaluating an electric characteristic and a method for forming the same are provided to test terminals not applied to the outside by forming a test pad inside the chip on film package including manual devices. CONSTITUTION: A chip on film package(10) is formed with an LCD driver chip(100), a signal line(170), the first and the second test pad(110,120), the first, the second, and the third manual device portion(140,150,160), and a signal input portion(130). The signal input portion(130) receives data and control signals from an external control circuit and transfers the received data and control signals to the LCD driver chip(100) through the signal line(170). The first manual device portion(140) is used for stabilizing each voltage(V0 to V4). The second manual device portion(150) includes resistances(R1,R2) for controlling a voltage of VO. The third manual device portion(160) is formed by capacitors(C2) for boosting the voltage. The first and the second test pad(110,120) are used for testing terminals which are not applied to the outside through the signal input portion(130). |
