| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor element in which a large number of electrode pads can be arranged without increasing the area of pad forming region in one semiconductor element and thereby without increasing the entire area of one semiconductor element itself. SOLUTION: In the semiconductor element 10B, a part of electrode pads 16A are arranged on a part of components inside an integrated circuit fabricated on a semiconductor wafer 12 and the remainder of the electrode pads 16B are arranged in the pad forming region 11B on the semiconductor wafer outside the integrated circuit, thus forming a so-called zigzag pad structure. |
