SOLDER BUMP FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for stably forming a solder bump with high precision. SOLUTION: A spacer provided with an opening corresponding to a place of solder bump land of a bump formation support to form a solder bump, is aligned and superposed with the bump forming support. The spacer opening is filled with a solder paste from above, on which a metal plate is stacked before the entire body is heated.