| 摘要 |
PROBLEM TO BE SOLVED: To prevent a conductive pad on the chip mounting surface from being stripped from an insulating substrate at the time of reliability test of a semiconductor device mounting a chip on the chip mounting substrate before shipment. SOLUTION: The semiconductor chip mounting substrate comprises an insulating substrate 11 employing synthetic resin as a basic material, a plurality of conductive pads 12 formed on the chip mounting surface of the insulating substrate and pattern wirings 13 corresponding to respective conductive pads and connected therewith, a plurality of pattern wirings 14 formed on the rear surface of the insulating substrate, and a plurality of through hole conductors 15 penetrating the insulating substrate and connecting the corresponding pattern wirings formed on the opposite sides of the insulating substrate. The conductive pads formed on the chip mounting surface and the pattern wirings on the rear surface of the substrate being connected with the conductive pads through the pattern wirings on the chip mounting surface and the through hole conductors are formed in such a positional relation as they do not face each other on the opposite sides of the substrate.
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