| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered circuit board precursor that can be applied to reduce the thickness of an insulating film and can suppress the cutting and exposure of internal wiring at dicing time caused by the positional deviation, etc., of the wiring and the reliability drop of the wiring caused by the cutting and exposure. SOLUTION: A multilayered circuit board is manufactured by forming a laminate A on a resin film 11 by repetitively forming insulating films 13 which are formed by applying and drying slurry containing a ceramic material and an organic binder, via-hole conductors 14, and wiring patterns 15 which are formed by applying conductive paste to the surfaces of the films 13 and drying the paste. Then the laminate A is removed from the resin film 11 and baked. The maximum coefficient of thermal shrinkage of the resin film 11 in the thermal history of the film 11 from the formation of the insulating film 13 on the film 11 to the removal of the laminate A from the film 11 is controlled to <=0.3%, by sticking the film 11 to a supporting substrate 12 which is low in thermal shrinkage. |
