发明名称 |
HEAT SINK TO BE MOUNTED ON PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To reduce the number of components to reduce the man-hours by connecting a plurality of heat sinks different in potential with a conductive insulator and improve the radiation efficiency by thermally connecting a plurality of radiation fins. SOLUTION: An insulator 8 is fastened to a first and second power semiconductor elements 2, 4 and heat sinks 3, 5 together by screws 10 to physically and heat conductively connect the first and second power semiconductor elements 2, 4 to the heat sinks 3, 5. This reduces the number of components to improve the assembling efficiency and the radiation efficiency due to thermal connection. |
申请公布号 |
JP2002299865(A) |
申请公布日期 |
2002.10.11 |
申请号 |
JP20010095750 |
申请日期 |
2001.03.29 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAKAI SHINICHI;MORIKAWA HISASHI |
分类号 |
H05K7/20;H01L23/36;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|