发明名称 HEAT SINK TO BE MOUNTED ON PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce the number of components to reduce the man-hours by connecting a plurality of heat sinks different in potential with a conductive insulator and improve the radiation efficiency by thermally connecting a plurality of radiation fins. SOLUTION: An insulator 8 is fastened to a first and second power semiconductor elements 2, 4 and heat sinks 3, 5 together by screws 10 to physically and heat conductively connect the first and second power semiconductor elements 2, 4 to the heat sinks 3, 5. This reduces the number of components to improve the assembling efficiency and the radiation efficiency due to thermal connection.
申请公布号 JP2002299865(A) 申请公布日期 2002.10.11
申请号 JP20010095750 申请日期 2001.03.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAI SHINICHI;MORIKAWA HISASHI
分类号 H05K7/20;H01L23/36;(IPC1-7):H05K7/20 主分类号 H05K7/20
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