发明名称 PRODUCTION METHOD FOR SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the influence exerted upon an electrode, of the discharge of static electricity caused by the pyroelectricity of a piezoelectric substrate in the production process especially in the dicing process of a surface acoustic wave(SAW) device. SOLUTION: In this production method for SAW device by which an electrode is formed on the piezoelectric substrate and the substrate is divided into chips, conductive or semiconductive thin film treatment is applied to the electrode covered with a protective film and after the substrate is divided into chips, the protective film and a thin film are removed. For the conductive membrane, an aluminium thin film is used.
申请公布号 JP2002299984(A) 申请公布日期 2002.10.11
申请号 JP20010101735 申请日期 2001.03.30
申请人 KINSEKI LTD 发明人 EGUCHI OSAMU;SASAKI JUN
分类号 H03H3/08;(IPC1-7):H03H3/08 主分类号 H03H3/08
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