| 摘要 |
PROBLEM TO BE SOLVED: To prevent drop in bondability at die bonding or wire bonding of a semiconductor device, where the bend is positioned within resin and the lead terminal is led out straight. SOLUTION: A lead frame with a difference in level, where first and second bends 20 and 21 are made at a lead 4 continuous to an island 2 is positioned on a heat block 8. The bend 21 is pushed down by the first projection 25 of a frame clamper, and the lead 4 is pressed and fixed by a second projection 26, so as to firmly stick the rear of the island 2 and the flat face of the projection 7 of the heat block 8 to each other. In this condition, the die bonding and wire bonding of the semiconductor chip 1 are performed, and the island 2 is heated efficiently. Moreover, horizontality of the island 2 and the semiconductor chip 1 can be kept.
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