PURPOSE: A cleaning method of semiconductor wafers is provided to effectively remove particles by using an improved cleaning solution. CONSTITUTION: A semiconductor wafer is prepared(10). The semiconductor wafer is firstly cleaned by using a first cleaning solution containing mixed solutions composed of NH4OH, H2O2 and deionized water(20). The semiconductor wafer is then secondly cleaned by using a second cleaning solution including mixed solutions made of HF and deionized water(30). After rinsing the remained second cleaning solutions, the wafer is dried(40).
