发明名称 APPARATUS AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method of manufacturing a printed- wiring board, where a film carrier is stripped easily, the stripped film carrier scrapping is facilitated, and the conveyance mechanism of a work can be simplified. SOLUTION: The apparatus 1 of manufacturing the printed wiring board is provided with a dry-film feed means 2, by which dry films 21a, 21b comprising resist films and carrier films 23a, 23b laminated on first faces of the resist films are pasted on the work, so as to bring second faces of the resist films into contact with the work 7; an exposure means 4 which transfers prescribed mask patterns on the dry films on the work as a part of the uncut dry films; and a carrier-film stripping means 6, by which the carrier films on the work are taken up from one end for stripping. The method of manufacturing the printed-wiring board uses the apparatus.
申请公布号 JP2002299797(A) 申请公布日期 2002.10.11
申请号 JP20010104805 申请日期 2001.04.03
申请人 SONY CORP 发明人 KANDA KENJI
分类号 G03F7/004;H05K3/00;H05K3/06 主分类号 G03F7/004
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