| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for monitoring a tape automatic bonding technique used to detect an aggregated state of a soft substrate, so as to reduce difficulty of reworking. SOLUTION: The apparatus for monitoring the tape automatic bonding treatment is used to attach a plurality of soft substrates formed in the state of a tape to the edge of the soft substrate. This apparatus comprises a sensor for monitoring the change of a light signal. The sensor is arranged to move along the edge of a hard substrate, so as to monitor the amount of the soft substrates according to the number of times of the changes of the signal.
|
