| 摘要 |
PURPOSE: A thin film device and a method for fabricating a substrate are provided to improve quality of a semiconductor and reduce a fabrication cost of the semiconductor by adhering a plurality of transparent ceramic substrates to each other and forming a thin film device on the transparent ceramic substrates. CONSTITUTION: A substrate is formed by adhering a plurality of ceramic substrates to each other. A thin film device is formed on the substrate. The ceramic substrate is formed by a transparent material. The ceramic substrate has a rectangular shape. In the substrate forming process, boundary parts between the ceramic substrates are adhered to each other. The ceramic substrates are adhered to each other by heating and melting the boundary parts between the ceramic substrates. The ceramic substrates are adhered to each other by inserting a predetermined material between the ceramic substrates.
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