| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate of good productivity for a semiconductor device and a method for manufacturing the semiconductor device, where resin repulsion near the corner of a dam is eliminated. SOLUTION: A substrate for a semiconductor device is provided where a plurality of circuit patterns capable of mounting a semiconductor element 5 are formed on an insulating board separable into individual semiconductor devices 31 after resin sealing with a liquid resin. With a material having a contact angle to the liquid resin smaller than the insulating board comprised, a film 12 which frames the circuit pattern is coated, and a dam 11 is superposed or circumscribed to the film 12 with the film 12 exposed inside the dam 11.</p> |
