发明名称 MULTILAYERED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayered circuit board which is capable of reducing electromagnetic interference sufficiently by decreasing the reflection of high- speed signals. SOLUTION: A first, second, third, fourth, and fifth insulating board, a first, a second, a third, and a fourth signal wire layer, a grounding wire layer, and a power supply wire layer are formed into a circuit board of thickness 1.6 mm or so by pressure welding. The first signal wire layer has a first resistance value to the grounding wire layer, the second signal wire layer has a second resistance value to the grounding wire layer and the power supply wire layer, the third signal wire layer has a third resistance value to the grounding wire layer and the power supply wire layer, and the fourth signal wire layer has a fourth resistance value to the power supply wire layer. The insulating boards are so set as to be within an optimal range, so that the first to the fourth resistance value are so set as to be 49.5 to 60.5Ωrespectively.
申请公布号 JP2002299815(A) 申请公布日期 2002.10.11
申请号 JP20010089968 申请日期 2001.03.27
申请人 SHEN TAA TEIEN NAO KOFUN YUGENKOSHI 发明人 CHON YUI CHIAN
分类号 B32B7/02;B32B15/08;H05K3/46;(IPC1-7):H05K3/46 主分类号 B32B7/02
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