发明名称 CONDUCTIVE PASTE AND CHIP TYPE ELECTRONIC COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste that does not make deformation such as a horn-shape protrusion in the painting drying process and can be painted in a uniform thickness and further does not have breakage of edges in the baking process when it is used for forming an outer electrode of a chip type electronic component such as a laminated ceramic capacitor. SOLUTION: This is a conductive paste that is formed in as an outer electrode by being painted on a prescribed face of a chip type electronic component, and the viscosity of the conductive paste is in the range of 150-350 Poise, and the conductive paste is constructed of at least a metallic powder containing a globe shape metallic powder and a flake shape metallic powder in the weight ratio of 0:100-30:70, a resin content, and a solvent.
申请公布号 JP2002298649(A) 申请公布日期 2002.10.11
申请号 JP20010097726 申请日期 2001.03.29
申请人 KYOCERA CORP 发明人 ISHIDA HIDEYUKI
分类号 H01G4/12;H01B1/00;H01B1/22;H01G4/30;(IPC1-7):H01B1/22 主分类号 H01G4/12
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