发明名称 SEMICONDUCTOR DEVICE INCLUDING DIFFUSION BARRIER FORMED BETWEEN METAL PATTERN AND INTERLAYER DIELECTRIC AND METHOD FOR FABRICATING THE SAME
摘要 PURPOSE: A semiconductor device including a diffusion barrier formed between a metal pattern and an interlayer dielectric and a method for fabricating the same are provided to prevent contraction of a metal pattern by forming a diffusion barrier between floating oxide layers formed between the metal pattern and the metal pattern. CONSTITUTION: An interlayer dielectric(10) is formed on a semiconductor substrate. A metal pattern(12) is formed on the interlayer dielectric(10). A fire-resistant metal layer is formed on a whole surface of the semiconductor substrate. A spacer(14) is formed on a sidewall of the metal pattern(12). A thermal process is performed on the semiconductor substrate during 10 minutes to 3 hours. A diffusion barrier(16) is formed by combining oxygen component of the spacer(14) with metallic component of the metal pattern(12). A floating oxide layer(18) is formed thereon. The thermal process is performed on the floating oxide layer(18).
申请公布号 KR20020076475(A) 申请公布日期 2002.10.11
申请号 KR20010016328 申请日期 2001.03.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, SEONG MAN;KO, JANG MAN
分类号 H01L21/28;(IPC1-7):H01L21/28 主分类号 H01L21/28
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