LEAD FRAME AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame not generating package cracks or wire disconnections at the time of solder reflow. SOLUTION: The lead frame 1 is used for forming a semiconductor package. Surface roughening plating 10 with large ruggedness is performed on at least a surface in contact with sealing resin 7, metal plating is executed to a part required for wire bonding from the top of the surface roughening plating 10, and a plating part for connections is formed. Since at least the lead frame surface in contact with the sealing resin is covered with the surface roughening plating 10 with the strong ruggedness, adhesion is excellent due to the anchor action of the sealing resin 7, boundary peeling does not occur at the time of the solder reflow and thus, the package cracks and the wire disconnections are not caused.