发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the thermal deformation of a beam as much as possible and to improve positioning precision when an electronic component is mounted. SOLUTION: A needle 13 generates heat by driving a Y-axis linear motor 7. Since a heat insulating member 21 having small heat conductivity is arranged between bases 20 and 20 at the right/left lower parts of the beam 6 and the needle 13, heat conduction from the needles 13 and 13 to the bases 20 and 20 of the beam 6 when the beam 6 is driven is suppressed to be less by the heat insulating member 21. The local temperature rise of the beam 6 is prevented, thermal deformation is avoided, and positioning precision when the electronic component is mounted is improved.
申请公布号 JP2002299892(A) 申请公布日期 2002.10.11
申请号 JP20010100871 申请日期 2001.03.30
申请人 SANYO ELECTRIC CO LTD;SANYO HIGH TECHNOLOGY CO LTD 发明人 KASHIWATANI NAOKATSU
分类号 B25J15/06;H05K7/20;H05K13/04 主分类号 B25J15/06
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