发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate comprising an insulator layer of a high breakdown voltage, in a method of manufacturing a semiconductor substrate wherein a SiGe layer is stacked at least on the insulator layer. SOLUTION: The method of manufacturing a semiconductor substrate comprises a first process of forming the SiGe layer 1 on a silicon substrate 3, and a second process of forming the insulator layer 2 on the silicon substrate 3.
申请公布号 JP2002299590(A) 申请公布日期 2002.10.11
申请号 JP20010095028 申请日期 2001.03.29
申请人 TOSHIBA CORP 发明人 NUMATA TOSHINORI;MIZUNO TOMOHISA
分类号 H01L21/265;H01L21/02;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 主分类号 H01L21/265
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