发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate comprising an insulator layer of a high breakdown voltage, in a method of manufacturing a semiconductor substrate wherein a SiGe layer is stacked at least on the insulator layer. SOLUTION: The method of manufacturing a semiconductor substrate comprises a first process of forming the SiGe layer 1 on a silicon substrate 3, and a second process of forming the insulator layer 2 on the silicon substrate 3.
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申请公布号 |
JP2002299590(A) |
申请公布日期 |
2002.10.11 |
申请号 |
JP20010095028 |
申请日期 |
2001.03.29 |
申请人 |
TOSHIBA CORP |
发明人 |
NUMATA TOSHINORI;MIZUNO TOMOHISA |
分类号 |
H01L21/265;H01L21/02;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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