RESIN SEALING METHOD AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin sealing method by which a resin sealing operation can be well carried out because resin used in a preceding resin sealing process is not left in a perforated plate when only sealing target parts out of sealing target parts and non-sealing target parts which are mixedly mounted on a board are sealed up with resin and a wiring board mounted with the parts sealed up with resin through the above sealing method. SOLUTION: A perforated plate having the same perforation pattern with the sealing target parts having a mounting pattern on a board is prepared when only sealing target parts out of sealing target parts and non-sealing target parts which are mixedly mounted on a board are sealed up with resin, through- holes bored in the perforated plate and the sealing target sealing parts are aligned with each other, and the board is restrained from coming into contact with the openings of the through-holes located on the rear of the perforated plate.