| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which is capable of restraining Ag contained in a surface wiring conductor film from being diffused into an overcoat layer. SOLUTION: An Ag wiring conductor film 2 is formed on the surface of a glass ceramic board 1, and an overcoat layer 6 of glass ceramic material is formed on the surface of the glass ceramic board 1 for the formation of a circuit board, partially covering the wiring conductor film 2. The overcoat layer 6 is formed of material composed of 100 pts.wt. inorganic solid component and 4.0 to below 6.0 pts.wt. metal oxide as an additive selected out of metal oxides such as MnO2 , CrO3 , and Fe2 O3 .
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