发明名称 |
FILM CARRIER TAPE FOR MOUNTING MULTIPLE-STRIP ELECTRONIC COMPONENTS AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a film carrier tape for mounting multiple-strip electronic components, capable of markedly improving the manufacturing capability of the film carrier tape for mounting the component via one-row manufacturing line without the need for replacing various components which correspond to the width of the carrier tape for mounting a plurality of types of the electronic components. SOLUTION: A plurality of film carrier tapes for mounting the electronic components of a desired width are formed in a parallel connected state, while sandwiching an insulation film having a predetermined width obtained by adding a width, capable of forming holes necessary to position the insulation film in a width which is integral number times of the width of the carrier tape for mounting the desired component between roller, without using sprocket wheels for conveying and rotating the rollers, in a state in which the plurality of the carrier tapes are connected in parallel.
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申请公布号 |
JP2002299390(A) |
申请公布日期 |
2002.10.11 |
申请号 |
JP20010100329 |
申请日期 |
2001.03.30 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
SUMI SHINICHI;KOURA SADAHIKO;TEJIMA YUJI |
分类号 |
B65B15/04;B65G49/07;H01L21/48;H01L21/50;H01L21/60;H01L21/68;H05K13/00;(IPC1-7):H01L21/60 |
主分类号 |
B65B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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