SURFACE TREATMENT METHOD FOR BARRIER METAL PRIOR TO COPPER DEPOSITION TO IMPROVE ADHESION AND TRENCH FILLING CHARACTERISTIC

摘要

PURPOSE: A surface treatment method for a barrier metal prior to copper deposition to improve adhesion and a trench filling characteristic is provided to reduce a transformation of a copper layer caused by a copper precursor in depositing the copper layer by performing a pretreatment process on a barrier metal layer. CONSTITUTION: An integrated circuit device(10) is prepared which includes the barrier metal layer(16) and is partially finished. A pretreatment process is performed at a temperature of higher than 200 deg.C for 30 seconds to form a pretreated barrier metal layer. The copper layer is deposited on the pretreated barrier metal layer.