LAMINATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOR

摘要

PROBLEM TO BE SOLVED: To provide a laminated semiconductor device and the manufacturing method for preventing generation of stress cracks inside the sealing resin constituting a package and improving reliability. SOLUTION: For the laminated semiconductor device, a first semiconductor element 12 and a second semiconductor element 15 are laminated and mounted on a wiring board 10, and the outer periphery is sealed with the sealing resin 16. Since the surface peripheral edge of at least the second semiconductor element 15 whose contact area with the sealing resin 16 is large is provided with a tapered oblique side 15s, generation of the stress cracks inside the sealing resin 16 constituting the package is prevented and the reliability is improved.