发明名称 BOARD, FOR MOUNTING OPTICAL-COMPONENT AND OPTICAL MODULE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an optical-component mounting board and an optical module where the transmission of high-frequency signal, having a transmission speed nearly equal to 10 Gbps or not lower than 10 Gbps, is made possible, and its high-frequency transmission characteristic will not become unstable due to its impedance mismatching being generated, in contact with its package. SOLUTION: The optical-component mounting board B has a first wiring board 10 and a second wiring board. With respect to the first wiring board 10, an inclined surface 12a is formed in its end portion for providing therein an optical semiconductor element 5a to form in the inclined surface 12a wirings for thereby applying currents to the optical semiconductor element 5a. With respect to the second wiring board, in the end portion of the second wiring board an inclined surface 12b is formed for joining it to the inclined surface 12a of the first wiring board 10 to form in the inclined surface 12b, and in its rear surface connected with the inclined surface 12b wirings 9c for applying thereby the currents to the optical semiconductor element 5a.
申请公布号 JP2002299743(A) 申请公布日期 2002.10.11
申请号 JP20010102688 申请日期 2001.03.30
申请人 KYOCERA CORP 发明人 FUKANO TORU
分类号 H01S5/022;(IPC1-7):H01S5/022 主分类号 H01S5/022
代理机构 代理人
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