| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is improved in moisture absorption resistance and can suppress the deterioration of its reliability. SOLUTION: This semiconductor device is provided with a fuse 11a and first and second moisture-proof ring members 13a, 13b, 15a, and 15b separately formed on the fuse 11a. Each ring member is formed by superposing a first Al-alloy layer and a second Al-alloy layer upon another. This device is also provided with water-proof ring walls arranged to surround the outer periphery of the fuse 11a. Consequently, the moisture absorption resistance of this device is improved and the deterioration of the reliability of this device can be suppressed.
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