| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor paste by which a membrane conductor having a solder heat resistance of practically sufficient level can be formed, without using in large quantity an expensive precious metal such as Pd or making separately Ni plating treatment or the like. SOLUTION: This is a conductor paste that is mainly made of a metal powder and that metal powder is in substance constructed of a particulate made of Ag, or Ag based alloy that is coated by an organic metal compound on its surface. And that organic metal compound is an organic acid metallic salt constructed principally of a metal element selected from a group of Al, Zr, Ti, Y, Ca, Mg and Zn, a metallic alkoxide or a chelate compound.
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