| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting structure, capable of sufficiently assuring reliability of electrically connecting a substrate conductive pattern to a conductive adhesive, and to provide a method for mounting the semiconductor chip. SOLUTION: (a) In a flip-chip mounting for disposing a circuit board 1, having a conductive pattern oppositely to an electrode 3 on the surface of the semiconductor chip 2 and electrically connecting the electrode 3 to the board 1; the conductive adhesive 5 is transferred to and coated on the salient electrodes 5; (b) the chip 2 is aligned so that the electrode 4 is contacted with gold stud bumps 6; the adhesive 5 is cured by heating and mounting on the board 2 and is electrically connected; and (c) since a semiconductor chip mounting structure, formed by sealing with a sealing resin 7, can be formed uniformly and stably in a shape of the electrode 4, reliability of the electrical connection can be improved as compared with that by the conventional methods.
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